摘要
采用基于可靠路径排序的快速二维相位解包裹算法检测PCB板上焊锡的三维形貌时,焊锡面形受到周边噪音影响较大,难以检测出三维面形,或者相对高度难以计算。为了实现对PCB板上焊锡三维形貌的稳定快速测量,本文在该算法的基础上进行了进一步的研究。设计了两个模板来辅助相位求解,首先通过迭代法得到截取图像的二值化模板,然后通过数学形态学方法提取焊锡区域,产生一个形态学模板,同时使用相位倒数方差图代替原算法的二阶差分图,将两个模板和生成的质量图结合,限定区域指导相位展开,最后将检测的结果进行归0化。实验结果证明改进算法的稳定性和正确率得到了提高,且改进算法主要是加入了模板计算和归0化计算,其检测速度与原算法相差较小,能够满足快速实时的要求。
Fast two-dimensional phase-unwrapping algorithm based on sorting by reliability following a noncontinuous path measuring the 3 d shape of solder on PCB,the shape of solder is affected by the surrounding noise,it is difficult to detect the three-dimensional surface,or the relative height is difficult to calculate. In order to realize the steady and fast measure the 3 d shape of solder on PCB,this paper makes further research on the basis of this algorithm. Design two masks to assist the phase unwrapping,firstly,through the iterative method get the binarization template of the captured images,and then through the mathematical morphology get morphological template by the solder region,meanwhile the phase derivative variance map is used to replace the second difference map of the original algorithm,combine the two masks with the generated quality map,limited area and guidance phase unwrapping,finally,the results are normalized to 0. The experimental results show that the improved algorithm improved stability and accuracy,and the improved algorithm is mainly joined the mask and normalized to 0 calculation,its detection speed will fall small compare with the original algorithm,can satisfy the requirement of rapid,real time detection.
作者
徐天义
史耀群
金露
韩旭
杨鹏斌
伏燕军
XU Tianyi;SHI Yaoqun;JIN Lu;HAN Xu;YANG Pengbin;FU Yanjun(Key Laboratory of Nondestructive Testing,Nanehang Hangkong University,Nanehang 330063,China)
出处
《激光杂志》
北大核心
2018年第10期44-48,共5页
Laser Journal
基金
国家自然科学基金(No.61661034,No.61465010)
江西省重点研发计划(20171BBE50012)
江西省教育厅科技计划(DA201808191)
关键词
相位解包裹
噪音消除
算法改进
模板设计
phase unwrapping
noise elimination
algorithm improvement
mask design
