摘要
利用有限元仿真软件COMSOL,对基于声表面行波(tsaw)粒子分选芯片及体声波(baw)粒子富集芯片进行了分析并加以实验验证。在仿真软件中分别模拟声表面行波粒子分选芯片的声波传播、声场形成、粒子轨迹以及体声波粒子富集芯片的声场形成、粒子轨迹,分析其运作机理,对肉眼不可见的声波、声场分布做出可视化效果。实验结果说明这两种芯片基于不同原理,都可对微米级的硅球完成可控的操作,并对于后续的器件创新和优化打下基础。
This work reported the simulations of microsphere manipulations via TSAW and BAW using finite element analysis software（COMSOL MULTIPHYSICS）and verified the feasibility by devices fabrication and silicon microsphere experiment.Simulations included the displacement of acoustic wave,distribution of acoustic field,microspheres tracing of TSAW devises and distribution of acoustic field,microspheres tracing of BAW devises,respectively.Experiment results approved those two chips could complete controllable microsphere manipulations.The visualizations of theories would be the foundation of following devise innovations and optimizations.
作者
朱叶子
刘慧琴
舒溪
国世上
ZHU Yezi,LIU Huiqin,SHU Xi,GUO Shishang(Physics Department,Key Laboratory of Artificial Micro- and Nano-Structure of Ministry of Education and Schoolof Physics and Technology,Wuhan University,Wuhan 430072,China)
出处
《传感技术学报》
CAS
CSCD
北大核心
2018年第8期1147-1152,共6页
Chinese Journal of Sensors and Actuators
基金
国家自然科学基金面上项目(81572860)
