摘要
研究分析了多功能模块化MEMS的背景、发展现状及工艺,采用模块化技术,研究具有一定通用性的多功能组装模块和封装模块,并将柔性自动化微操作技术与模块化MEMS组装与封装工艺设备结合起来,研究适用于多种MEMS器件、高效率、高质量的柔性自动化MEMS组装与封装关键设备,实现MEMS从组装到封装的后端制造柔性自动化操作的解决方案,符合我国目前MEMS发展现状,可以满足MEMS技术发展的多种需求。
This paper studies and analyzes the background,development status of MEMS. Studying thegeneral assembly module and encapsulation module using modular technology,combining flexibleautomation micro operation technology with modular MEMS assembly and packaging processequipment,researching on key flexible automation MEMS assembly and packaging equipment whichis efficient,high quality and suitable for a variety of MEMS devices,achieving the solution of MEMSbackend manufacturing flexible automation operation from assembly to encapsulation,conform to thecurrent situation of MEMS development in China and can meet a variety of requirements for thedevelopment of MEMS technology.
作者
张志能
ZHANG Zhineng(Han＇s Laser Technology Industry Group Co.Ltd,Shenzhen 518057,China)
出处
《电子工业专用设备》
2018年第4期1-6,共6页
Equipment for Electronic Products Manufacturing
关键词
微机电系统
多功能模块化
封装设备
Micro electro mechanical system （MEMS）
Multi-functional modular
Assembly＆packaging equipment
