摘要
建立了杯型金刚石砂轮稳定延性域磨削过程中砂轮微单元与硅片的微接触力学模型,采用力分解法研究了其自旋转磨削微观作用机理。法向分解分别运用接触力学中的赫兹理论和"空腔模型"理论分析得出硅片上对应弹性和塑性阶段的载荷和应力分布情况,以及砂轮微单元上相应的应力分布情况;切向分解运用微观摩擦学理论分析得出滑动摩擦力以及法、切向合成微接触总应力的情况。分析与试验对比结果证明了本文方法有效,可为硅片自旋转磨削机理研究提供理论支撑。
Self rotating grinding with cup type diamond wheel is a typical ultra precision grinding process for silicon wafer.In this paper,a mechanical model of the micro contact between the wheel micro unit and silicon wafer was established for the stable ductile grinding process,and the mechanism of self rotating grinding was studied using force decomposition method.On the normal direction,the load and stress distribution of the corresponding elastic and plastic stages were obtained using the Hertz theory and the cavity model respectively.On the tangential direction,the sliding friction force was obtained using micro tribology theory.The load in the two directions was synthesized and the total stress condition was obtained.The analysis results were verified by corresponding experiment and simulation.
作者
任庆磊
魏昕
谢小柱
胡伟
REN Qing -lei;WEI Xin;XIE Xiao- zhu;HU Wei(School of Electro-mechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China)
出处
《吉林大学学报（工学版）》
EI
CAS
CSCD
北大核心
2018年第3期796-802,共7页
Journal of Jilin University:Engineering and Technology Edition
基金
国家自然科学基金项目(U0734008)
广东省自然科学基金项目(8151009001000048)
广东工业大学校青年基金项目(082042)
关键词
机械制造及自动化
自旋转磨削
微接触
硅片
砂轮微单元
mechanical manufacture and automation
self rotating grinding
micro contact
silicon wafer
wheel micro unit
