摘要
本文介绍了智能卡的封装流程,指出了智能卡产品外观检查与电性能测试所面临的问题,提出了用AOI(全自动光学图像检测)来解决所面临的问题。同时,通过一系列试验,解决了AOI检测面临的检测难题,并基于AOI结构重建,满足与相关设备全自动匹配的要求,成功地开发出符合产品检查要求的AOI系统,最终创建了AOI相关工艺,经过试验与改善,得出该系统能够满足使用要求的结论,最后指出了封装AOI全自动系统改造发展方向。
This paper introduces the packaging process of chip card, points out the problems faced by chip card product appearance inspection and electrical performance test, and puts forward the problem that AOI （ automatic optical image detection ） can solve. Through a series of experiments, the problem of AOI detection is solved. Through structure reconstruction, the system is able to work with related equipment. Finally, an AOI system that meets the requirements of product inspection is successfully developed and AOI related process is created. After DoE and implementation of improvement, the conclusion that the system can meet the requirements of the use case is reached. The direction of AOI automatic development in assembly area is suggested at last.
作者
郑志荣
许晓东
尤大威
ZHENG Zhi-rong;XU Xiao-dong;YOU Da-wei(Infineon Technologies （ Wuxi ） Co., Ltd., Wuxi 214028, China)
出处
《中国集成电路》
2018年第3期48-53,59,共7页
China lntegrated Circuit
