期刊文献+

退火工艺对连续同步叠轧超细晶纯铜组织与性能的影响

Effects of Annealing Process on Microstructure and Properties of Ultra-fine Grain Pure Copper after Continuous Synchronization Accumulative Roll-bonding
下载PDF
导出
摘要 采用连续同步叠轧技术对纯铜(99.9%)进行等效应变约为4.8的6道次叠轧试验,用拉伸试验、光学显微镜(OM)、透射电子显微镜(TEM)对比分析退火温度和退火方式对铜材组织性能的影响。结果表明,就"一步"法而言,退火温度从170℃增加到550℃,维氏硬度呈先增后降的趋势,270℃达到最大,为143.5 HV5;270℃保温30 min后晶粒发生完全再结晶,且平均晶粒尺寸由原始态的140μm细化到40μm,抗拉强度达371 MPa,延伸率为16%;对叠轧后铜材采用先170℃保温6 h后空冷,再350℃保温30 min的"两步"退火法,可获得微米晶与纳米晶共存的组织特征,其室温下抗拉强度达280 MPa,总延伸率超过25%。 The continuous synchronization accumulative roll-bonding process was applied to pure copper (99.9 % ) , and the equivalent strain reached 4. 8 after 6 pass rolling. The effects of annealing temperature and methods on the mierostructure and properties of copper were comparative studied by tensile testing, OM and TEM. The results show that using the "one step" annealing, with the increment of annealing temperature from 170 ℃ to 550 ℃ , the vickers hardness increases first and then decreases. The highest value of hardness is 143 HV5 under 270 ℃. The fully recrystallization is observed when heated at 270 ℃ for 30 min. The average grain size is refined from 140 μm to 40 μm, and the tensile strength reach 380 MPa, as well the elongation is 16%. The "two step" heat-treatment, which involves annealing at 170 ℃ for 6 h first, and annealing at 350 ℃ for 30 min, ensure to obtain the bimodal grain distribution with micro-meter and nano-meter size. Meanwhile, the tensile strength reach to 270 MPa and the total elongation exceed 25%.
出处 《有色金属工程》 CAS CSCD 北大核心 2018年第1期1-5,共5页 Nonferrous Metals Engineering
基金 国家自然科学基金资助项目(51264012) 江西省青年自然科学基金资助(2014BAB2160012)
关键词 叠轧焊 退火 组织 力学性能 accumulative roll bonding annealing microstructure mechanical properties
  • 相关文献

参考文献11

二级参考文献195

共引文献77

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部