摘要
基于提高数字阵列模块的高可靠性,以热设计分析为出发点,通过综合考虑单机的工作环境等条件,主要采用风冷的冷却形式,将数字单机的工作热量进行传递出去,并对该数字单机进行相应的结构设计。该方法成功应用于工程实践中,并对后续产品的批产具有重要的指导意义。
Aiming to improve the reliability of the digital array module,this research,based on the analysis of thermal design and the working environment,adopted the forced convection cooling method to transfer the heat energy out of the module.In addition,the corresponding structural design was carried out as well.The proposed method was successfully applied into practice,which is of great significance in guiding the future manufacturing.
出处
《机械与电子》
2018年第1期7-9,共3页
Machinery & Electronics
关键词
结构设计
热设计
数字阵列模块
可靠性
structural design
thermal design
digital array module
reliability
