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碳纤维增强碳化硅三维网状多孔陶瓷复合材料的制备 被引量:6

Preparation of carbon fiber reinforced silicon carbide porous ceramic composites with three dimensional network structure
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摘要 以3D打印多孔PLA结构为模板,采用聚碳硅烷先驱体浸渍裂解法(PIP),在1 250℃,氩气氛围下烧结得到碳纤维增强碳化硅三维网状多孔陶瓷复合材料。采用XRD、SEM和万能力学试验机等对碳纤维增强碳化硅三维网状多孔陶瓷复合材料进行了表征。结果表明,由β-SiC和C两种晶相组成,随着3D打印件的骨架直径增大,所制备的3D-Cf/SiC多孔陶瓷复合材料的孔隙率逐渐减小,而其表观密度、骨架密度、压缩强度、导热系数逐渐增加;当3D打印件的骨架直径从1.0mm增加到2.5mm时,3D-Cf/SiC的孔径从1.0mm增加到2.5mm,孔隙率从63%增加到82%,表观密度和骨架密度分别从0.85g/cm3降低至0.45g/cm3,1.52g/cm3降低至0.92g/cm3,压缩强度从8.00 MPa降低至4.20 MPa,导热系数从2.00 W/(m·K)降低至1.20 W/(m·K)。 By combination of precursor infiltration pyrolysis(PIP)and three-dimentional printing methods,carbon fiber reinforced silicon carbide porous ceramic composites(3 D-Cf/SiC porous ceramic composites)with three-dimensional open-celled network structure were successfully fabricated.Carbide fibers and polycarbosilane used as raw materials were sintered at 1 250 ℃in argon atmosphere.The phase composition,microstructure and compressive strength were characterized by X-ray diffraction(XRD),scanning electron microscopy(SEM)and universal material testing machine.The results show that the phase composition of 3 D-Cf/SiC porous ceramic composites consisted ofβ-SiC and C.As the diameter of porous ceramic composites increased,the porosity decreased and the bulk density,skeleton density,compressive strength and thermal conductivity increased.When the diameter of the porous ceramic composites increased from 1.0 to 2.5 mm,the pore size increased from1.0 to 2.5 mm,the porosity increased from 63%to 82%,and the bulk density,skeleton density,compressive strength and thermal conductivity decreased from 0.85 to 0.45 g/cm^3,1.52 to 0.92 g/cm^3,8.00 to 4.20 MPa and2.00 to 1.20 W/(m·K),respectively.
出处 《功能材料》 EI CAS CSCD 北大核心 2018年第1期1005-1008,1016,共5页 Journal of Functional Materials
基金 国家高技术研究发展计划(863计划)资助项目(2015AA7024034 2015AA7051510 2014AA7060403)
关键词 三维网状结构 碳纤维增强碳化硅 压缩强度 导热系数 3D打印 three-dimensional network structure carbon fiber reinforced silicon carbide compressive strength thermal conductivity three-dimensional printing
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