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电流密度对脉冲电镀Sn-Ni-Mn合金镀层的影响

Effect of Current Density on Pulse Electroplating Sn-Ni-Mn Alloy Coating
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摘要 采用脉冲电镀法在Q235钢表面制备Sn-Ni-Mn合金镀层。利用辉光放电光谱仪(GDS)、扫描电镜(SEM)、Tafel曲线和电化学阻抗谱(EIS)等考察不同电流密度下所制备的Sn-Ni-Mn合金镀层的阴极电流效率、成分、沉积速率、表面形貌及耐腐蚀性。结果表明:随电流密度增大,镀层中Sn、Ni质量分数降低,Mn质量分数升高;镀层沉积速率先增大后减小;镀层表面晶粒细化;镀层耐蚀性先增强后减弱;电流密度为10A/dm^2时,所得镀层在3.5%NaCl溶液中的自腐蚀电位为-0.372V,最低腐蚀电流密度为6.76μA·dm^(-2),最大电荷转移电阻为8 349Ω·cm^2,耐蚀性最好。 Sn-Ni-Mn alloy coatings were prepared on the surface of Q235 steel by pulse electroplating. The effect of current density on coating component content, deposition rate, surface morphology, cathode current efficiency and corrosion resistance was investigated by glow discharge spectroscopy (GDS) ,scanning electron microscopy(SEM),Tafel curve and electrochemical impedance spectroscopy (EIS). The results showed that with increasing current density,the content of Sn and Ni decreased, while the content of Mn increased; cathode current efficiency was declined; deposition rate raised firstly and then dropped; the size of grains on coating surface was refined, corrosion resistance increased firstly and then decreased. In 3. 5% NaCl solution, the coating prepared at the current density of 10 A dm--2 with the most positive corrosion potential ( -- 0. 372 V), the lowest corrosion current density(6.76 μA · dm^-2) and the biggest charge transfer resistance(8 349 12 · cm^2) exhibited the best corrosion resistance.
出处 《湿法冶金》 CAS 北大核心 2018年第1期70-73,共4页 Hydrometallurgy of China
基金 国家自然科学基金资助项目(51474088) 华北理工大学研究生创新项目(2017S13)
关键词 脉冲电镀 Sn-Ni-Mn镀层 电流密度 耐蚀性 pulse electroplating Sn-Ni-Mn coating current density corrosion resistance
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