摘要
集成电路的封装包括塑料封装、陶瓷封装、金属封装,前者适用工业级封装,后两者适用军用气密性封装。工业级的塑料封装器件与军用气密性封装器件相比以其低成本的优势占领了大部分的集成电路封装市场。但随着客户的可靠性要求越来越高,制造端成本控制的压力越来越大,一方面因客户的产品使用条件促使其对产品的质量性能要求提高,另一方面随着竞争的加剧产品价格一降再降,对制造商的生产成本压力越来越大,按照一般流程控制生产的工业级塑封器件对于客户的高可靠性要求已不能很好地满足,现行工业级塑封器件在严酷的环境试验中会导致出现失效。其中塑封材科的选用关系到制造商的成本与客户端的质量要求之间的平衡问题,为了应对成本的挑战,该文研究了如何在满足客户要求的前提下优选合适的塑封料以降低生产成本,同时满足客户的需求,并提出相应要求集成电路后封装过程进行低成本质量控制的方案。
The packaging of integrated circuits including plastic packaging,ceramic packaging,metal packaging,the former is applicable to industrial packaging,the latter two are suitable for military airtight packaging.industrial-grade plastic packaging devices and military gas-tightness packaging devices,compared with its low-cost advantages to occupy most of the integrated circuit packaging market.But as the customer＇s reliability requirements become more and more high,manufacturing end cost control more and more pressure,on the one hand because the customer＇s product use conditions to promote its product quality performance requirements,on the other hand as the competition intensifies product prices drop again,the manufacturer＇s production costs more and more pressure.According to the general process control of the production of industrial grade plastic sealing devices for the customer＇s high reliability requirements have not been very well satisfied,the current industrial grade of plastic seal devices in the harsh environmental test will lead to failure.The selection of plastic sealing material is related to the balance between the manufacturer＇s cost and the client＇s quality requirements, how to deal with the challenge of the cost,this paper studies how to optimize the suitable plastic sealing material in order to reduce the production cost and meet the customer＇s demand.The method of low cost quality control in the process of integrated circuit encapsulation is put forward.
出处
《电子质量》
2018年第1期29-33,共5页
Electronics Quality
关键词
集成电路
封装
低成本
质量控制
Integrated circuit
Packaging
Low cost
Quality control
