摘要
通过磁控溅射离子镀与中频脉冲偏压电源相结合,优化制备(Al,Ti)N涂层的工艺。利用HVS-1000数显显微硬度计检测涂层硬度;MET-400多功能材料表面试验仪测定膜基结合力,JS-QHY-2型球痕仪测定厚度,DX-1000型X射线衍射仪检测物相。采用正交实验,作算术平均值和极差分析,优化制备涂层的工艺。结果表明波动时,最佳工艺为功率为10:24,脉冲偏压为100V,时间为2.5h,不波动时最佳工艺为5:24,脉冲偏压为100V,时间为2.5h。
The preparation of （Ti, Al） N coating was optimized by magnetron sputtering ion plating combined with medium frequency magnetron sputtering power supply. The hardness of the coating was measured by HVS-1000 digital micro hardness tester, and the thickness was measured using the JS-QHY-2 ball mark. Orthogonal experiments were used to optimize the preparation process of the coating by arithmetic mean and range analysis. The results show that the magnitude of the influencing factors the best process power is 10：24, the pulse bias is 100V, the time is 2.5h, and the influencing factor is the best process is 5：24, the pulse bias is 100V, the time is 2.5h.
作者
左伟峰
赵广彬
程玺儒
ZUO Wei-feng;ZHAO Guang-bin;CHENG Xi-ru(School of Materials Science and Engineering, Xihua University, Chengdu 610039, China)
出处
《真空》
CAS
2017年第6期21-25,共5页
Vacuum
基金
"高档数控机床与基础制造装备"科技重大专项资助(2009X 04012-23)
四川省特种材料及制备技术重点实验室基金(SZJJ2009-016)
关键词
正交实验
硬度
膜厚
膜基结合力
orthogonal experiment, hardness, film thickness, influencing factors
