摘要
ta-C薄膜是性能优良的耐摩擦超硬薄膜,但其残余应力过大问题严重影响了其力学性能及实际应用。根据脉冲磁过滤多弧离子镀沉积ta-C薄膜的工艺,进行了膜系设计并沉积制备出以不锈钢为基底的Ti/ta-C复合膜。通过有限元方法,建立数值计算模型,研究了薄膜热应力与膜层厚度、基底厚度和沉积温度等参数变化的规律,得到Ti/ta-C复合膜的热应力分布,模拟与理论计算结果误差较小,揭示了脉冲磁过滤多弧离子镀沉积ta-C薄膜厚度的有效控制的途径,为完善脉冲磁过滤多弧离子镀沉积ta-C薄膜的工艺,提供了理论依据。实验研究了不同沉积温度下薄膜的硬度和残余应力、热应力的关系,结果表明,热应力增加会导致薄膜硬度降低,但不会导致残余应力的明显变化,即热应力不是脉冲磁过滤多弧离子镀沉积ta-C薄膜残余应力过大的主要因素。
The ta-C film is a kind of friction resistant superhard film with excellent properties, but its residual stress is too large, which seriously affects its mechanical properties and practical applications. According to the process of pulsed magnetic filtered multi arc ion deposition of ta-C film, the Ti/ta-C composite film structure was designed and deposited on stainless steel. By using the finite element method, a numerical simulation model was established to simulate the variation of thin film thermal stress with film thickness, substrate thickness and deposition temperature. The thermal stress distribution of the Ti/ta-C composite film was obtained, and the error between simulation and theoretical calculation was small. It revealed that the effective way to control the pulse filtered deposition of ta-C film thickness, plating process for deposition of ta-C thin film to improve the pulse filtered multi arc ion, provided a theoretical basis. The relationship of the hardness, the residual stress and thermal stress of the films at different deposition temperatures was investigated. The results showed that the increased thermal stress will decrease the hardness of the films, but would not lead to significant changes in the residual stress. Thermal stress was not the main factor of residual stress in ta-C film deposited by pulsed magnetic filtered multi arc ion plating.
作者
陈长琦
何涛
王国栋
张心凤
CHEN Chang-qi;HE Tao;WANG Guo-dong;ZHANG Xin-feng(Institute of Vacuum Technology and Equipment, Hefei University of Technology, Hefei 230009, China;Anhui Pure Source Coating Technology Co., Ltd., Hefei 230009, China)
出处
《真空》
CAS
2017年第6期7-11,共5页
Vacuum
