摘要
本征光敏型聚酰亚胺(PSPI)具有优良的热稳定性、感光性、力学性能和介电性能,其在MCM组件中的应用,将进一步降低组件的重量、提高封装密度。在国外,PSPI在MCM中的应用已较为成熟,而国内在这方面与国外有较大的差距。为此,文章从应用的角度出发,研究了PSPI的光刻特性,优化工艺参数后,厚度10μm的PSPI可刻出Φ30μm的微孔;PSPI表面沉积金属的附着力是难点和关键,文中重点对PSPI表面金属化工艺进行了研究,通过对PSPI进行等离子处理工艺的优化,在其表面TiW-CuAu膜层的附着力满足要求,附着力达25 MPa;在此基础上,制作出了"3层介质+3层电路"的多层薄膜微波测试电路。结果表明,测试电路层间导通良好,在1~40 GHz范围内插入损耗小于0.85 d B,回波损耗小于-13 d B。
Intrinsical Photosensitive-polyimide （PSPI） has excellent thermal-stability, phototonus, mechanical properties and dielectric properties, which can be used in MCM module and greatly reduce weight and improve packing density of the module. PSPI has been applied in MCM for several years abroad. Compared with devel- oped industrial countries there is a large gap at home. In this paper, lithography properties and process param- eter are studied. A small aperture of 30μm is formed in the PSPI of 10μm. The adhesion of mental film on PSPI is key and nodus. Metalized technics on surface of PSPI is studied. The adhesion of TiW-Cu-Au film reaches 25 MPa by plasma treatment. On this basis, the test circuit of multi-layer thin film micro-wave with ＂three-layer PSPI ＋ three-layer circuit＂ is produced. The result shows that the conduction between layers of the test circuit is good, the insertion loss is smaller than 0.85 dB and the return loss is smaller than -13 dB in the range of i -40 GHz.
出处
《电子机械工程》
2017年第4期48-51,54,共5页
Electro-Mechanical Engineering
