摘要
在经历了2015年密集的兼并重组和技术产能升级之后,2016年我国集成电路封装测试业持续稳步快速发展。2016年我国集成电路封装测试业销售收入为1 564.3亿元,增速达13%,略高于2015年的11.7%。经过2016年的转化发展,内资封测企业和外资、合资封测企业同步发展,国内市场与国际市场并行发展,技术升级和产能提升并举,近期目标与长远战略互相兼顾,已成为我国集成电路封装测试业在"十三五"期间发展的新常态。
After the intensive merger and reorganization and technical capacity upgrading in 2015, China＇s IC packaging and testing industry continued to develop steadily and rapidly in 2016. In 2016, the sales revenue of China＇s IC packaging and testing industry was 156 billion 430 million yuan, with a growth rate of 13%, slightly higher than 11.7% in 2015. After the transformation in 2016, domestic and foreign investment, joint venture enterprise is the synchronous development in packaging. The domestic market and the international market are developing in parallel. Technological upgrading and capacity upgrading are being developed simultaneously. Recent goals and long- term strategies are mutually balanced. It has become the new norm of China＇s IC packaging and testing industry development in the ＂13th Five-Year＂ period.
出处
《集成电路应用》
2017年第11期52-55,共4页
Application of IC
基金
上海市软件和集成电路产业发展专项基金(2016.160505)
