摘要
随着电子系统通信速率的不断提升,BGA封装与PCB互连区域的信号完整性问题越来越突出。针对高速BGA封装与PCB差分互连结构进行设计与优化,着重分析封装与PCB互连区域差分布线方式,信号布局方式,信号孔/地孔比,布线层与过孔残桩这四个方面对高速差分信号传输性能和串扰的具体影响。利用全波电磁场仿真软件CST建立3D仿真模型,最后时频域仿真验证了所述的优化方法能够有效改善高速差分信号传输性能,减小信号间串扰,实现更好的信号隔离。
With the constantly increase of the communication rate of the electronic systems,the signal integrity between BGA packaging and PCB interconnection area becomes particularly prominent.The high-speed BGA packaging and PCB differential interconnection structure were designed and optimized.The specific influences of the packaging and PCB interconnection area differential wiring mode,signal distribution mode,S/G ratio,wiring layer and via hole stub on the transmission performance of the high-speed differential signal and crosstalk performance are analyzed emphatically.The full wave electromagnetic field simulation software CST is used to establish the 3 D simulation model.The optimization method was verified with time-frequency domain simulation,which can improve the transmission performance of the high-speed differential signal,reduce the crosstalk among signals,and realize the perfect signal isolation.
出处
《现代电子技术》
北大核心
2017年第22期137-141,共5页
Modern Electronics Technique
基金
河北省高等学校高层次人才科学研究资助项目(GCC2014011)
关键词
串扰
封装
差分过孔
信号完整性
CST
crosstalk
packaging
differential via hole
signal integrity
CST
