摘要
针对某型电子机箱的故障,利用SolidworksFlow Simulation对其进行了热分析,得到了机箱内部的温度分布,明确了故障原因为器件温度过高。通过对元器件布局的优化,并重新进行热分析,结果表明机箱内部器件的温度分布明显改善,并且该电子机箱内部器件经重新布局后,未出现故障。
Aiming at the faults of an electronic chassis,the thermal analysis is carried out by using SolidworksFlow Simulation,and gets the temperature distribution of components inside of the chassis. The reason of the fault is that the device temperature is too high. Through the optimization on the layout of components and making thermal analysis again,the results show that the temperature distribution of the internal parts of the chassis is obviously improved. And no fault is found after the layout for the internal components of the electronic chassis.
出处
《山西电子技术》
2017年第5期26-27,36,共3页
Shanxi Electronic Technology
