摘要
This paper describes a novel finite element thermal analysis model for an AIGalnP-LED micro-array device. We also conduct a transient analysis for the internal temperature field distribution of a 5x5 array device when a 3x3 unit is driven by pulse current. In addition, for broader applications, a simplified thermal analysis model is introduced and its accuracy is verified. The internal temperature field distribution of 100xl00 units is calculated using the simplified model. The temperature at the device center reaches 360.6 ℃ after 1.5 s. In order to solve the heat dissipation problem of the device, an optimized heat dissipation structure is designed, and the effects of the number and size of the heat dissipation fins on the thermal characteristics of the device are analyzed.
作者
TIAN Chao
GUO Shu-xu
LIANG Jing-qiu
LIANG Zhong-zhu
GAO Feng-li
田超;郭树旭;梁静秋;梁中翥;郜峰利(State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University;Semiconductor Manufacturing North China (Beijing) Corporation;Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences)
基金
supported by the Young Scientists Fund of the National Natural Science Foundation of China(No.61204055)
