摘要
为了准确模拟块体非晶合金凝固过程的温度场,对浇注温度为840℃的非晶合金凝固期间的温度场进行了数据采集.根据界面换热模型与热量守恒定律建立了液固相与铜模之间的界面换热关系式,从而实现了对非晶凝固温度场的模拟.结果表明,合金与铜模之间的界面换热系数随温度的增加而增大.合金在液态阶段降温曲线的模拟值与实测值基本吻合,且当凝固温度降至500℃后,二者偏差也较小.利用界面换热模型并结合实测温度场可以表征非晶合金凝固时的界面换热关系.
In order to accurately simulate the temperature field of bulk amorphous alloy in the solidification process,the temperature field data of amorphous alloy during the solidification with the pouring temperature of 840 ℃ were collected. According to the interfacial heat transfer model and heat conservation law,the interfacial heat transfer coefficient relationship between the liquid-solid phases and copper mold was established,and the simulation of temperature field in the solidification process of amorphous alloy was realized. The results show that the interfacial heat transfer coefficient between the alloy and copper mold increases with increasing the temperature. The simulated value obtained from the cooling curves of the alloy melt is basically in agreement with the measured value. The deviation of both simulated and measured values is small when the solidification temperature reduces to about 500 ℃. The interfacial heat transfer model in combination with the measured temperature field can be used to characterize the interfacial heat transfer relationship of amorphous alloy during the solidification.
出处
《沈阳工业大学学报》
EI
CAS
北大核心
2017年第5期496-500,共5页
Journal of Shenyang University of Technology
基金
教育部博士点基金资助项目(20132102110005)
沈阳市科技计划项目(F14-231-1-22)
关键词
非晶合金
界面换热系数
热物性参数
快速凝固
数值模拟
温度场
冷却速度
铜模
amorphous alloy
interfacial heat transfer coefficient
thermophysical parameter
rapid solidification
numerical simulation
temperature field
cooling rate
copper mold
