摘要
文中设计了一种用于电子器件散热的风冷机箱,通过在机箱内部设置翅片、热扩展板等方式强化散热效果,建立了机箱内部流动与传热的三维理论模型,计算分析了引流板角度、引流板长度、翅片结构、风速等因素对电子器件散热的影响。结果显示,风速由1 m/s提升到3 m/s后,机箱内最高节点温度降低了约30℃;而引流板长度在150 mm,偏转角度120°时,机箱节点温度最低,为61.6℃。因此,引流板长度、角度的增大及风速的提高有助于机箱散热,翅片和热扩展板的设置也可使得散热效果得到增强。
In this paper, a modular electronical chassis which cooled by air is designed. The heat dissipation effect is enhanced by fins and thermal expansion layer inside the Chassis. A three-dimensional theoretical model of flow and heat transfer inside the chassis is established. The influences of the angle, length of the flow baffle, the fins, and the wind speed on the heat dissipation of electronic devices are calculated and analyzed. The results show that when the wind speed increases from 1 m / s to 3 m / s , the node temperature decreases about 30℃. And the node temperature tends to he lowest when the flow baffle at the size of 150 mm and 120°. As a result, the increase of the length and angle of the flow baffle and the wind speed will enhance the heat dissipation of the chassis, and the fins and the heat pipe can also enhance the heat dissipation effect.
作者
张琰佳
李强
ZHANG Yan-jia LI Qiang(Nanjing University of Science and Technology, Nanfing 210094, China)
出处
《电子机械工程》
2017年第3期29-35,共7页
Electro-Mechanical Engineering
关键词
热设计
风冷
引流板
thermal design
air cooling
flow baffle
