摘要
通过分析超微矩形电连接器技术与标准,发现传统焊接方式对超微矩形电连接器造成制约、需针对超微矩形电连接器焊接试验方法在详细规范中做出相应的要求和规定。并对超微矩形电连接器电装回流焊和激光焊进行对比分析,研究表明激光焊接在焊接尺寸、精度、强度、效率和热影响区域等方面都存在较大优势,展望了激光焊接在微组装领域的发展趋势。
The limitation of traditional soldering for nanominiature rectangular electrical connector （NREC） is exhibited by analyzing the standard and technology of NREC, and the soldering experimential methods for NREC need to be required and specified in the detail specification. Moreover, the advantages of laser soldering, for example, weld size, accuracy, intensity, efficiency and heat-effect-zone, are demonstrated by comparing the reflow soldering in the field of electric fitting. Finally, the research significance and the future development of laser soldering for micropackage is demonstrated in this essay.
出处
《信息技术与标准化》
2017年第6期74-77,共4页
Information Technology & Standardization
关键词
激光焊接
超微矩形电连接器
电子元器件
微组装
laser soldering
nanominiature rectangular electrical connector
electronic component
micropackage
