摘要
采用OM、XRD、SEM和拉力试验机,研究了钎焊工艺参数对SnAg0.5CuZn0.1Ni/Cu无铅微焊点界面金属间化合物(IMC)和力学性能的影响。结果表明:添加0.1%Ni(质量分数)能显著细化SnAg0.5CuZn钎料合金的初生β-Sn相和共晶组织;钎焊温度为270℃、钎焊时间为240 s时,钎焊接头的剪切强度达到最大值47 MPa。
OM,XRD,SEM and tensile testing were used to study the effects of brazing parameters on the intermetallic compounds（IMC） and mechanical properties of SnAg0.5CuZn0.1Ni/Cu lead-free solder joints. The results reveal that addition of 0.1% Ni（mass percent） can refine the primary β-Sn phase and eutectic structure of SnAg0.5CuZn solder alloy obviously. The maximum shear strength of 47 MPa is obtained from the joint soldered under the soldering temperature of 270 ℃ and soldering time of 240 s.
出处
《粉末冶金工业》
CAS
北大核心
2017年第3期44-48,共5页
Powder Metallurgy Industry
基金
湖北省教育厅科学研究计划指导性项目(B2016174)
关键词
钎焊
界面
金属间化合物
剪切强度
soldering
interface
intermetallic compound
shear strength
