摘要
以氨丙基三乙氧基硅烷(KH550)为反应单体,通过水解缩合反应合成了以Si—O—Si为主要链段,—NH为活泼基团的环氧树脂固化剂。利用—NH_2与环氧基团的反应将耐热性较好的Si—O—Si链段引入到交联网络中。通过反应原料和产物的红外吸收光谱和核磁共振波谱对比分析证明了水解缩合反应的发生;通过非等温DSC分析和T-β外推法确定了反应体系的固化特征温度;用环氧树脂E51混合体系粘接的黄铜板,其相对最大剪切强度为14.4 MPa,固化物在N氛围中失重10%的温度为378.6℃,残炭率为26.2%。
The curing agent for epoxy resins was synthesized by the hydrolysis and condensation reactions of aminopropyltriethoxysilane （KH550） to obtain a structure with Si-O-Si as the main segments and -NH2 as the reactive groups. The -NH2 groups of the curing agent reacted with the epoxy groups of epoxy resins to introduce the thermal stable Si-O-Si chain into the cross-linked network. The hydrolysis and condensation reactions were proved by comparing the FTIR and 1H NMR spectra of raw materials and reaction products, and the curing characteristic temperatures of reaction system were determined by non-isothermal DSC analysis and T- β extrapolation method. The maximum shear strength for bonding the bross substrate with E51 epoxy resin based mixture system was 14.4 MPa; the temperature at 10% weight loss of cured epoxy resin was 378.6 %2 in N2 atmosphere. When the content of curing agent was 20 parts, the residual amount was 26.2%.
出处
《粘接》
CAS
2017年第6期23-26,共4页
Adhesion
关键词
环氧树脂
有机硅
固化剂
耐热性
epoxy resin
organosilicon
curing agent
heat resistance
