摘要
当今便携式设备的速率可达数吉比特每秒,但是其通道的频宽限制其性能。在所有芯片与基板的传输结构中键合线是最常用的,但却渐渐成为了带宽主要的限制。基于一款高密度布线系统级封装的研发项目,使用全波电磁场仿真工具进行建模分析,研究了不同参数对键合传输线DDR单端信号与差分信号传输质量的影响。最终通过键合线设计的优化,仿真结果通过了眼图的验证。
Today＇s portable electrical devices can run at gigabits per second （Gbps）, but the bandwidth of the channel limits its performance. Among all the transmission structures between the chips and substrates, the bonding wire is the most commonly used, but it is becoming a major bandwidth constraint. This paper is based on the research and development project of high-density wiring System-in-Package. Modeling analysis is conducted with the full-wave electromagnetic field simulation tools to research the influences of different parameters on DDR single-ended and differential signal transmission quality of the bonding wire transmission line. Finally, through the optimization of bonding wire design, the simulation results were verified by eye diagram.
出处
《电子与封装》
2017年第3期13-18,共6页
Electronics & Packaging
关键词
键合线
系统级封装
DDR
单端信号
差分信号
bonding wire
System-in-Package
DDR
single-ended signal
differential signal
