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聚焦离子束(FIB)直写技术研究 被引量:1

Research on the focused ion beam milling technology
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摘要 简单介绍了聚焦离子束的工作原理,以及在微电子行业中的应用。具体讨论了聚焦离子束在制备纳米图形中的影响因素,包括不同的加工参数,如离子束电能量、离子束电流、驻留时间,以及不同的制备方法产生的各效应,包括再沉积、结构干涉再沉积,对结构形貌的影响,从而确定各参数在纳米图形制备过程中的应用。实验结果表明,离子束能量改变了入射离子去除材料的能力、离子束电流改变了制备图形(线、方)结构的深宽比,驻留时间的变化增加了刻蚀结构中再沉积效应。 The working principle of focused ion beam and its application in microelectronic field are introduced in this paper. Tile influence factors of focused ion beam on the preparation of nano-scale patterning are discussed in detail, including the influence of different processing parameters, such as ion beam energy, ion beam current, dwell time and so on, and different effect from different preparation methods, such as redeposition effect andstructural interference redeposition effect, on the structure and morphology, so as to determine the applications of them in the preparation of micro-structures. Experiments demonstrate that the ion beam energy changes the removal ability of incident ion from substrate materials, different ion current introduces various aspect ratio of the patterned micro-structures, and the larger dwell time makes greater growth of the re-deposition in the etching.
作者 金乾进 柴青
出处 《传感器世界》 2017年第3期12-15,共4页 Sensor World
关键词 聚焦离子束 纳米图形制备 加工参数 结构 focused ion beam: nano scale patterning process parameter micro/nano structure
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