摘要
基于单颗磨粒切削路径规划和未变形切屑厚度模型,建立加工表面残留高度与加工参数之间的关系模型。在高精度数控平面磨床上进行单颗磨粒切削氮化硅陶瓷加工实验,结果表明残留高度与与切削力呈正相关关系。当材料去除方式为以脆性裂纹扩展控制的断裂破碎时,加工表面残留高度现象相对明显。通过对正交实验结果进行分析,获得有助于降低表面残留高度的加工参数组合,可用于指导实际磨削加工,并通过磨削实验进行验证。
Based on the path planning of single grain cutting and modelling of undeformed chip thickness,the relationship model between the residual height of machined surface and processing parameters was established. The silicon nitride ceramics cutting experiments with single abrasive grain were carried out with surface grinding machine. The results show that the residual height correlates positively with the cutting force. The surface residual height is more obvious when the material removal mode is brittle fracture which is controlled by brittle crack propagation. The optimized combinations of processing parameters are obtained via orthogonal experiment,which can help to reduce the surface residual height and guide the actual grinding. The conclusions are verified by wheel grinding experiments.
作者
万林林
刘志坚
邓朝晖
刘伟
WAN Linlin LIU Zhijian DENG Zhaohui LIU Wei(Intelligent Manufacturing Institute of Hunan University of Science Technology, Xiangtan 411201, China Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material, Hunan University of Science Technology, Xiangtan 411201, China)
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
2017年第2期1-7,共7页
Ordnance Material Science and Engineering
基金
国家自然科学基金资助项目(51405152)
难加工材料高效精密加工湖南省重点实验室开放基金资助项目(E21433)
关键词
氮化硅陶瓷
残留高度
未变形切屑厚度
单颗磨粒
silicon nitride ceramic
residual height
undeformed chip thickness
single diamond grain
