摘要
通过改变工艺参数,采用非平衡磁控溅射法在硬质合金基体上制备Ti Al N涂层来研究涂层微观结构的变化规律。经表面和断口形貌的扫描电镜结果显示,增加主因素偏压,涂层表面趋向光滑平整,结构趋向致密,表面的大颗粒数量明显减少。EDS能谱分析表明,涂层元素的含量受偏压和N2流量影响较大。XRD分析发现,膜层中有Ti Al N系和Ti N系的物相结构,Ti N/Ti Al N多层涂层主要从(111)晶面择优取向生长。
By unbalanced magnetron sputtering and process parameter changing,the Ti Al N coatings deposited on cemented carbide substrates and the related coating microstructures were studied. Surface and fracture morphologies by SEM show that with the increase of bias voltage,the coating surface tends to be smoother,the structure more compact,and the quantity of superficial big-sized particles is decreased. Meanwhile,EDS spectrum analysis shows that the coating element contents are influenced mainly by the flow and pressure of Nitrogen. The analysis by XRD also show that Ti Al N and Ti Nbased phase structures are found in the films and Ti N/Ti Al N multilayer coatings grow preferentially in（111） crystal face orientation.
出处
《工具技术》
北大核心
2017年第2期64-67,共4页
Tool Engineering
基金
"高档数控机床与基础制造装备"科技重大专项资助(20092X04012-23)
四川省特种材料及制备技术重点实验室基金(SZJJ2009-016)
关键词
非平衡磁控溅射
TI
AL
N涂层
偏压
微观结构
unbalanced magnetron sputtering
Ti Al N coating
bias voltage
microstructure
