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一种共聚型聚酰亚胺成膜工艺的探究 被引量:1

Exploration of one copolymerization polyimide film forming process
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摘要 采用溶液缩聚法通过共聚的方式合成得到了聚酰胺酸(PAA),PAA经过热酰亚胺化得到聚酰亚胺(PI)薄膜。重点讨论了成膜工艺中的升温速率对薄膜结构和性能的影响,分别以1、3、5、7和9℃/min的升温速率制备出5种PI薄膜。同时对薄膜进行了红外、X射线衍射、扫描电镜和综合热分析等表征。结果显示:不同升温速率得到的PI薄膜的结构和性能上均有明显的差异,其中以5℃/min升温速率制备的PI薄膜性能最优,具有最高的热分解温度,最高的玻璃化转变温度,最强的结晶度。 The polyamic acids(PAA)were synthesied by solution condensation through the way of copolymerization.The PI films was obtained by thermal imidization from PAA.The effect of heating rate to the structure and properties of films during the film forming process were mainly discussed.Five PI films were prepared with five different heating rates as follows:1℃/min,3℃/min,5℃/min,7℃/min and 9℃/min.The films were characterized using fourier transform infrared(FT-IR),wide angle X-ray diffraction(XRD),scanning electron microscopy(SEM),thermogravimetric analysis(TGA).The results showed that different heating rates had obvious differences on the structure and properties of films.The PI of 5℃/min heating rate(PI-3)had the best properties among the PIs.Which had the highest thermal decomposition temperature,the highest glass transition temperature and the strongest degree of crystallinity.
出处 《化工新型材料》 CAS CSCD 北大核心 2017年第1期88-90,94,共4页 New Chemical Materials
关键词 聚酰亚胺 共聚 成膜工艺 升温速率 polyimide copolymerization film forming process heating rate
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