摘要
铜及铜合金本身没有催化活性,其诱发方法比较复杂。综述了外接电源法、化学活化法、电化学活化法等铜及铜合金化学镀Ni-P合金镀层的诱发方法,并展望了诱发方法的发展方向。
Copper and copper alloy have no catalytic activity, the induced methods of them are more complex. The induced methods of electroless Ni-P alloy coating on copper and copper alloy, like external power method, chemical activation method, electrochemical activation method, etc, were summarized, and the development direction of induced methods was also predicted.
作者
王敏
刘锦云
WANG Mini LIU Jin-yun(Engineering Technology Center, Southwest University of Science and Engineering, Mianyang 621010, China School of Materials Science and Engineering, Xihua University, Chengdu 610039, China)
出处
《电镀与环保》
CAS
CSCD
北大核心
2017年第1期4-6,共3页
Electroplating & Pollution Control
