摘要
文中建立了由过孔、焊点、印制线构成的高速电路板双路径复杂互连结构的单元模型。在1～10GHz频率范围内分析其近端串扰的传输性能。结果表明：随着路径间距的减小。双路径复杂互连结构的近端串扰越强。提出了双路径复杂互连结构的等效电路模型，其近端串扰在1～10GHz频率范围内与物理模型仿真结果相差不超过3％。
A high-speed circuit board complex interconnect structural unit model was established,which consisted of the via holes, the welding spots and the printed lines.The transmission performance at frequency range from 1 GHz to 10 GHz of the nearend crosstalk of the double path complex interconnection structure were analyzed.The results show that, along with the decrease of the spacing of the path, the near-end crosstalk of the double path complex interconnection structure become stronger. An equivalent circuit model of the double path complex interconnect structure was presented, which shows that the difference on nearend crosstalk in 1 - 10 GHz frequency range is not more than 3% compared with the simulation result of physical model.
出处
《仪表技术与传感器》
CSCD
北大核心
2016年第11期98-101,共4页
Instrument Technique and Sensor
基金
国家自然科学基金(51465013)
广西研究生教育创新计划资助项目(YCSZ2014142)
桂林电子科技大学研究生创新项目(GDYCSZ201443
GDYCSZ201480)
广西自动检测技术与仪器重点实验室主任基金(YQ15109)
关键词
信号完整性
过孔
焊点
双路径复杂互连结构
等效电路模型
近端串扰
Signal integrity
via holes
solder balls
dual-path complex interconnect structure model
equivalent circuit model
nearend crosstalk
