摘要
根据固体与分子的经验理论,采用键距法(BLD法)计算了不同W含量的Ta-W固溶体合金最强键上的共价电子数n_A、强度因子η和键能Ea。探讨了n_A、η和Ea之间的关系以及与Ta-W固溶体合金力学性能的关系。计算结果表明,在一定的W含量范围内(≤50%,质量分数),随着W含量的增加,n_A、η、Ea总体是呈上升趋势,固溶体合金的强度、硬度也呈上升趋势。
Based on an empirical electron theory of solids and molecules, covalence electron number （nA ）, intensity factor（η）, and bond energy （Ea）on the strongest bond for Ta-W solid solution alloy with different tungsten contents were calculated with the use of a bond distance method （BLD）. The relationship among Ea , nA and η, and their dependence on mechanical properties of the Ta-W solid solution alloy were explored. The results show that as the tungsten content increases up to 50% by mass so too do nA , η and Ea, as well as the strength and hardness of the Ta-W solid solution alloy.
作者
严骏
刘宁
陈天宝
YAN Jun LIU Ning CHEN Tianbao(School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, Anhui Chin)
出处
《热处理》
CAS
2016年第5期22-25,共4页
Heat Treatment
关键词
价电子
强度
硬度
固溶体
valence electron
strength
hardness
solid solution
