摘要
通过使用高导热封装材料及热传导效率高的热结构,从而显著降低器件的封装热阻,提高器件的温度等级,实现了一种最高工作温度达200℃的高速数据采集与处理系统级封装。该系统级封装由数字信号处理（DSP）、现场可编程门阵列（FPGA）、模拟-数字转换器（ADC）及存储器等外围器件组成,具有模拟信号数据采集、数字信号处理、串行通信、多路数字输入检测和输出控制等功能,其中差分输入模拟信号的最大可允许电压峰峰值为4 V,所用12 bit ADC最高采样频率为20 MHz,数据存储深度最大可配置为144 kbit,测试表明其在25-200℃环境温度内,信号幅度的变化在0.4 dB内,较好地解决了高温测井仪器高速数据采集问题。
Using package materials and thermal structure with high thermal conductivity,the thermal resistance of device was obviously decreased and the temperature grade was increased. And a system-level packaging of high speed data acquisition and processing with a maximum operating temperature of 200 ℃ was completed. The system-level packaging was comprised of digital signal process（ DSP）,field-programmable gate array（ FPGA）,analog-to-digital converter（ ADC）,memorizer and other external devices,had the functions of analog signal data acquiring,digital signal processing,serial communications,multi channel digital input detecting and output controling. The allowable maximum peak to peak voltage of the differential-input analog input signal was 4 V,and the maximum sampling frequency of the 12 bit ADC system was 20 MHz. The maximum data storage depth can be configured as144 kbit. The test results show that,the amplitude of the signal changes within 0. 4 dB at the temperature from 25 ℃ to 200 ℃,which better solves the problem on high speed data acquisition of logging instrument at high temperature.
作者
黄琳
孟祥隆
张嘉伟
程晶晶
Huang Lin Meng Xianglong Zhang Jiawei Cheng Jingjing(Well-Tech R＆D Institutes, China Oilfield Service Limited, Beijing 101149, China School of Automation, Huazhong University of Science and Technology, Wuhan 430074, China)
出处
《半导体技术》
CAS
CSCD
北大核心
2016年第10期779-783,共5页
Semiconductor Technology
基金
高等学校博士学科点专项科研基金资助项目(20130142120065)
关键词
高温随钻测井仪器
高速数据采集
系统级封装(SiP)
封装热阻
数据处理
high temperature logging while drilling tool
high speed data acquisition
system in package（SiP）
package thermal resistance
data processing
