摘要
MEMS技术促进了各种传感器的小型化和低成本化的发展,包括气体传感器。目前研制出的传感器系统,由于传感器芯片需要特殊的包封形式,故芯片封装需要的成本较高。为扩大气体传感器的应用范围,关键在于实现气体传感器的低成本、低功率、高可靠性封装,本文主要研究了气体传感器的封装技术。传统的半导体封装形式如TO封装价格昂贵,本文提出了一个采用PCB板作为基板的封装方案,该方案采用电阻为1-2Ω的导电环氧树脂作为电流连接线。同时需要在PCB基板上的加热器电源的基础上添加一个额外电源,能够使气体传感器薄膜加热温度达到到300℃以上。在两种不同的测试条件下对该气体传感器进行可靠性试验,分别是1小时高温可靠性试验和100次开/关重复测试。本封装方法相对于引线键合的一个附加优势是机械性能更加牢固,相对于TO封装的封装制程更加简单,大量的红外影像显示本封装器件具有良好的可靠性。
MEMS technologies have enabled the development of various sensors including gas sensors in a miniaturized and cost effective way. Sensor systems are being developed using these sensor chips where chip packaging is still a major cost due to special requirements. This paper focuses on the packaging needs of a MEMS based gas sensor. A low cost packaging solution for MEMS based gas sensors is elaborated.To enable the vast and multiple applications of these gas sensors it is important to provide a low cost sensor system which is low power and can be operated on battery. Standard semiconductor device packages like TO headers are costly and not suitable for low cost devices. Proposed packaging scheme uses printed circuit board（PCB）as substrate material where reliable low resistance（1-2Ω）interconnects are provided by conducting epoxy. PCB based packages add very little extra power（3-5 m W）to the power required for micro-heater that heats gas sensor film up to 300 ℃. Packaged gas sensors were tested for their reliability in two different conditions i.e. 1 hour ON reliability test and repetitive ON/OFF（100 times）test. These packages have additional advantages of being more mechanically stable than wire bonded packages and easy processing in comparison to Transistor Outline（TO）headers. Infrared imaging of the packaged device in forced condition shows the stability of the package.
出处
《中国集成电路》
2016年第7期65-68,共4页
China lntegrated Circuit
