摘要
废旧印刷电路板元器件拆解技术的研究是电子废弃物有效利用的重点环节。通过采用Design-Expert 8.0.6软件,对拆解过程中氟硼酸浓度,双氧水浓度和时间对铅、锡焊料的溶出率的影响趋势进行研究,得出最终优化实验方案为在双氧水浓度为0.5 mol·L^(-1)、氟硼酸浓度为2.5 mol·L^(-1)、反应时间为35 min的条件下铅、锡的溶出率分别为90.66%和99.91%,可视为铅、锡完全溶解并实现脱焊。该方法实现了电子元器件与印刷电路板的快速分离,将为电子废弃物的资源化提供理论支持和应用支撑。
A study on dismantling technology for waste printed circuit boards（ PCBs） is key to understanding how to reuse e-waste effectively. The influence of fluoboric acid concentration,hydrogen peroxide concentration,and time on the dissolution rate of lead-tin solder and copper in the process of dismantling was studied with the help of Design-Expert 8. 0. 6 software. The results showed that the optimal conditions for the dismantling process were a hydrogen peroxide concentration of 0. 5 mol·L^-1,a fluoboric acid concentration of 2. 5 mol·L^-1,and a reaction time of 35 min. Under the optimized experimental conditions,the dissolution rates of lead and tin were 90. 66% and 99. 91%,respectively. This method rapidly separated the electronic components from PCBs,thus providing theoretical and application support for the recovery of electronic waste.
出处
《环境工程学报》
CAS
CSCD
北大核心
2016年第8期4516-4522,共7页
Chinese Journal of Environmental Engineering
基金
中小企业创新基金(1305H146300)
上海市“晨光计划”(15CG60)
上海市自然科学基金(15ZR1416800)
上海电子废弃物资源化产学研合作开发中心开放基金(ZF1224)
上海高校青年教师资助计划(ZZZZEGD15011)
上海第二工业大学科研启动基金(EGD15XQD02)
上海第二工业大学培育学科资助(XXKPY1601)
浦东新区科技发展基金(PKJ2015-C07
PKJ2015-C14)
青浦区产学研合作发展资金(青产学研2015-9)
上海市“扬帆计划”(15YF1404300)
关键词
废旧印刷电路板
电子元器件
氟硼酸
锡铅焊料
溶出率
waste printed circuit board
electronic components
fluoboric acid
lead-tin solder
dissolution rate
