摘要
随着半导体技术的进步和发展,专业化分工越来越精细,后端设计、流片加工、封装、测试都已成为专门领域。而集成电路设计、加工各个环节环环相扣密不可分,任何一个环节出现问题都可能导致整个芯片流片的失败。因此如何保证每一个环节的正确性,是每一个集成电路设计单位都面临的问题,其中如何控制集成电路设计的关键外协工序也就变得尤为重要。文中对目前军用大规模集成电路的后端设计、芯片制造、封装的流程及关键工序进行了分析和论述,总结了设计方应重点关注的芯片的后端设计、流片、封装的工艺流程、关键工序及检查方法,对集成电路设计关键外协工序质量控制有较好的指导意义。
With the rapid advance and development of semiconductor technology,the division of labor has become more and more elaborate. The back- end design,chip processing,packaging and test has already developed into special areas. Integrated circuit design,processing and other steps are tied closely to each other,problems in any part of the whole procedure may lead to a chip tape- out failure.Therefore,howto ensure the correctness of every aspect of the whole procedure is always an important problem for every IC designer,especially for the problem of howto control the outsourcing procedure. Based on analysis of the process of back- end design,fabrication and packaging for military VLSI,it summarizes the key procedures and control methods of the back- end design,fabrication and packaging and checking in this paper,which is meaningful for the quality control of military VLSI outsourcing design.
出处
《计算机技术与发展》
2016年第5期170-172,178,共4页
Computer Technology and Development
基金
中国航空工业集团公司创新基金(2010BD63111)
