摘要
介绍日本2015年度版印制电路板技术路线图,第二部分是刚性印制电路板的内容,包括积层多层板、常规多层板、单面和双面板的状况。
This article introduces the printed circuit board technology roadmap of Japan＇s 2015 annual edition. The second part is the rigid printed circuit board, including build up multilayer board, and conventional multilayer board, single-sided and double-sided board.
出处
《印制电路信息》
2016年第5期9-18,41,共11页
Printed Circuit Information
