摘要
Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is proposed. The system mainly consists of three functional modules, including active quenching circuit（ AQC）, time-to-digital converter（ TDC） circuit and other timing controller circuit. Each AQC and TDC circuit together constitutes the pixel circuit. Under the cooperation with other modules, the current signal generated by the GM-APD sensor is detected by the AQC, and the photon time-of-flight（ TOF） is measured and converted to a digital signal output to achieve a better noise suppression and a higher detection sensitivity by the TDC. The ROIC circuit is fabricated by the CSMC 0. 5 μm standard CMOS technology. The array size is 8 × 8, and the center distance of two adjacent cells is 100μm. The measurement results of the chip showthat the performance of the circuit is good, and the chip can achieve 1 ns time resolution with a 250 MHz reference clock, and the circuit can be used in the array structure of the infrared detection system or focal plane array（ FPA）.
基于盖革模式(GM)雪崩光电二极管(GM-APD)探测阵列,设计了一种可用于红外3D成像的高性能红外传感读出电路(ROIC).该电路系统主要由主动淬火电路(AQC)、时间数字转换电路(TDC)和其他时序控制电路3个模块组成.AQC与TDC共同构成像素电路,在其余模块的配合下,由AQC电路检测GM-APD传感器产生的电流信号,TDC电路进行光子飞行时间(TOF)的计量,并转换为数字信号输出,从而实现更好的噪声抑制,更高的探测灵敏度.该电路采用CSMC 0.5μm标准CMOS工艺流片,阵列规模为8×8,像元中心距离100μm,芯片测试结果表明,电路功能良好,在250 MHz时钟驱动下,芯片可达到1 ns的时间分辨率,该电路可用于面阵结构红外探测系统或焦平面阵列.
基金
The Natural Science Foundation of Jiangsu Province(No.BK2012559)
Qing Lan Project of Jiangsu Province
