摘要
介绍了印制电路板(PCB)与外部电路、PCB内部之间的信号耦合,分析得出:PCB级电磁兼容性(EMC)设计的关键是板内信号参考地的设计。以双面板为例阐述了多层板进行叠层安排设计时应遵循的原则,给出了利用PCB Layout来控制PCB中关键寄生参数以防出现信号间串扰的方法。对数模混合电路中数字电路的内部噪声对低电平模拟信号的影响及分地的意义加以说明。提出了PCB设计时防止信号串扰的去耦和滤波方法及在多块PCB板互联时,规避电磁屏蔽(EMS)和电磁干扰(EMI)风险的方法。
The signal coupling between printed circuit board(PCB) plate,external circuit and PCB plate internal circuit is introduced.It is convinced that the key of PCB electro magnetic compatibility(EMC) design is the signal reference ground plate.The double sided board as example,it expounds the rules of multilayer board lamination arrangement,the method of using PCB layout to control the key parasitic parameters in order to prevent signal crosstalk is put forward.In hybrid analog-digital circuit,explained the significance of divided ground place and the influence which the interior noise in digital circuit on the low level analog signal.To prevent signal crosstalk,a method of decoupling and filter in PCB design is proposed.As well as in the multi-block PCB board interconnection,aim to avoid electro-magnetic susceptibility(EMS) and electromagnetic interference(EMI) risk.
出处
《电力电子技术》
CSCD
北大核心
2016年第2期101-105,共5页
Power Electronics
关键词
电磁兼容性
印刷线路板
参考地
electro magnetic compatibility
printed circuit board
reference ground