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含芳基噻唑基团环氧树脂材料的制备及热性能 被引量:1

Preparation and Thermal Property of Epoxy Resin Containing Aromatic Thiazole Groups
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摘要 制备了一种含芳基噻唑基团热稳定环氧树脂材料(TDABZ),通过傅里叶变换红外光谱(FTIR)对其结构进行了表征,采用热重分析-微熵热重分析(TGA-DTG)计算了TDABZ的热分解动力学参数,利用热重分析(TGA)和动态热机械分析(DMTA)探讨了TDABZ的耐热性能。结果表明,TDABZ通过TGDDM结构中的环氧基团与混合固化剂(DDS和2-ABZ)结构中的活泼氢反应,在较低的温度下就能完全交联固化。通过Kissinger和Ozawa方法求得TDABZ的热分解活化能分别为205.5和221.9 k J/mol。TDABZ固化物具有优异的耐热性能,双悬臂梁法测得的玻璃化转变温度(Tg)达到242.3℃,在N2气气氛下失重5%对应的温度(Td5)为340.2℃,最大失重速率对应的温度(Tdmax)为395.5℃,600℃的质量保留率为24.1%,显著提高了环氧树脂的热稳定性能,拓宽了其应用领域。 A kind of thermally stable epoxy resin containing aromatic thiazole groups (TDABZ) was prepared. The structure of TDABZ was characterized by Fourier transform infrared spectra ( FTIR), and the thermal degradation kinetics parameters were determined by thermogravimetric analysis-derivative thermogravimetry (TGA-DTG). The thermal stability of the cured resin was studied by thermogravimetric analysis (TGA) and dynamic thermomechanical analysis(DMTA). TDABZ was completely cured under controled condition by the reaction between epoxy group and the active nitrogen in DDS/2-ABZ. The activation energy value calculated by the Kissinger's and Ozawa's methods is 205.5 kJ/mol and 221.9 kJ/mol, respectively. The cured TDABZ exhibits excellent thermal stability with the glass transition temperature ( Ts) of 242.3 ℃, the temperature of 5% mass loss ( To5 ) and the temperature at maximum mass loss rate ( Tdmax ) are 242. 3 -(2 and 395.5 ℃, respectively, and the residue at 600 ℃ is up to 24. 1%, which can improve the thermal stability of epoxy resin, and broaden its applications.
出处 《应用化学》 CAS CSCD 北大核心 2016年第3期293-298,共6页 Chinese Journal of Applied Chemistry
基金 福建省自然科学基金项目(2015J05095) 福建省中青年教师教育科研项目(JA15107) 福建师范大学大学生创新创业训练计划(cxxl-2015106)资助~~
关键词 环氧树脂 制备 热解动力学 热性能 epoxy resin preparation thermal degradation kinetics thermal stability
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  • 1Jang K, Cho W J, Ha C S. Influence of Processing Method on the Fracture Toughness of Thermoplastic-Modified, Carbon- Fiber-Reinforced Epoxy Composites [ J ]. Compos Sci Technol, 1999,59 (7) :995-1001. 被引量:1
  • 2Liu H P, Uhlherr A, Bannister M K. Quantitative Structure Property Relationships for Composites: Prediction of Glass Transition Temperatures for Epoxy Resins [ J ]. Polymer, 2004,45 ( 6 ) : 2051-2060. 被引量:1
  • 3Meenakshi K S, Sudhan E P J. Development of Novel TGDDM Epoxy Nanocomposites for Aerospace and High Performance Applications Study of Their Thermal and Electrical Behavior[ J/OL]. Arab J Chem,2011-05-26. [ published online ahead of print ]. 被引量:1
  • 4孙曼灵..环氧树脂应用原理与技术[M],2002.
  • 5Bhuvana S, Sarojadevi M. Synthesis and Characterization of Epoxy/amine Terminated Amide-imide-imide Blends [ J ]. J Appl Polym Sci ,2008,108 (3) :2001-2009. 被引量:1
  • 6Mustafa M F, Cook W D, Schiller T L, et al. Curing Behavior and Thermal Properties of TGDDM Copolymerized with a New Pyridine-containing Diamine and with DDM or DDS[ J ]. Thermochim Acta,2014,575 (1) :21-28. 被引量:1
  • 7Liu W C,Varley R J, Simon G P. Understanding the Decomposition and Fire Performance Processes in Phosphorus and Nanomodified High Performance Epoxy Resins and Composites [ J ]. Polymer,2007,48 (8) :2345-2354. 被引量:1
  • 8Xu G R, Xu M J, Li B. Synthesis and Characterization of a Novel Epoxy Resin Based on Cyclotriphosphazene and Its Thermal Degradation and Flammability Performance [ J ]. Polym Degrad Stabil, 2014,109 ( 1 ) :240-248. 被引量:1
  • 9王启东,史铁钧,徐国梅.酚酞烯丙胺型苯并嗪树脂的合成、表征及其聚合物的热分解动力学[J].化工学报,2013,64(10):3851-3857. 被引量:12
  • 10何静,段雪,王作新.程序升温分解对PEEK热分解动力学及其机理的研究[J].化学学报,1997,55(12):1152-1157. 被引量:6

二级参考文献15

共引文献21

同被引文献18

  • 1杜善义,张博明.飞行器结构智能化研究及其发展趋势[J].宇航学报,2007,28(4):773-778. 被引量:31
  • 2AFZAL A,SIDDIQI H M,IQBAL N,et al.The effect of Si O2filler content and its organic compatibility on thermal stability of epoxy resin[J].Journal of Thermal Analysis and Calorimetry,2013,111(1):247-252. 被引量:1
  • 3LIN J,WU X,ZHENG C,et al.Synthesis and properties of epoxy-polyurethane/silica nanocomposites by a novel sol method and in-situ solution polymerization route[J].Applied Surface Science,2014,303(5):67-75. 被引量:1
  • 4LIU Y L,HSU C Y,WEI W L,et al.Preparation and thermal properties of epoxy-silica nanocomposites from nanoscale colloidal silica[J].Polymer,2003,44(18):5159-5167. 被引量:1
  • 5LIU Y L,WEI W L,HSU K Y,et al.Thermal stability of epoxy-silica hybrid materials by thermogravimetric analysis[J].Thermochimica Acta,2004,412(1/2):139-147. 被引量:1
  • 6MATJKA L,DUEK K,PLETIL J,et al.Formation and structure of the epoxy-silica hybrids[J].Polymer,1999,40(1):171-181. 被引量:1
  • 7TARRO-SAAVEDRA J,LPEZ-BECEIRO J,NAYA S,et al.Effect of silica content on thermal stability of fumed silica/epoxy composites[J].Polymer Degradation and Stability,2008,93(12):2133-2137. 被引量:1
  • 8BRUMA M,SCHULZ B,KPNICK T,et al.Investigation of thin films made from silicon-containing polyphenylquinoxaline-amides[J].High Performance Polymers,1998,10(2):207-215. 被引量:1
  • 9PARK S J,CHO M S.Thermal stability of carbon-Mo Si2-carbon composites by thermogravimetric analysis[J].Journal of Materials Science,2000,35(35):3525-3527. 被引量:1
  • 10ROY M,NELSON J K,MACCRONE R K,et al.Polymer nanocomposite dielectrics the role of the interface[J].IEEE Transactions on Dielectrics and Electrical Insulation,2005,12(4):629-643. 被引量:1

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