摘要
近年来出现了一种既可以实现一定的挠折性能且加工相对简单、成本较低的新型产品设计,即半刚挠板,满足了对挠折性能及成本的设计需求。本文主要从半刚挠板的材料选择、余厚控制、弯曲角度大小、不同工序制作等方面进行试验和阐述,成功地解决了存在的难题,优化并完善了此类产品的制作流程及控制方法。
In recent years there appeared a new product, which not only achieved bending performance but also simple to process with low cost design, namely semi-rigid-fl ex product. It meets the demand of the design of the bending and cost. In this paper, the materials residual thickness control and bending angle in different processes are research, which successfully solved the problem existed, and optimized and improved process method.
出处
《印制电路信息》
2016年第2期8-10,共3页
Printed Circuit Information
关键词
刚挠结合
半刚挠产品
Rigid-Flex Semi
Rigid-Flex Board
