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加速器单粒子效应样品温度测控系统研制及实验应用 被引量:3

Development and Experimental Application of Sample Temperature Measurement and Control System for Accelerator-based Single Event Effect
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摘要 为满足国内半导体器件单粒子效应(SEE)截面与温度的关系研究需求,本文基于北京HI-13串列加速器SEE辐照实验终端研制了样品温度测控系统,实现了90~450K范围内实验样品温度的测量和控制,系统控制精度好于±1K。为验证系统可靠性,使用该系统研究了SRAM单粒子翻转(SEU)截面随温度的变化关系,在215~353 K范围内测量了SRAM翻转截面随温度的变化曲线。结果表明,SRAM SEU截面随温度的升高而增加,与理论预期结果一致。 In order to meet domestic demands of studying the relationship between temperature and single event effect(SEE)cross-section,a device under test(DUT)temperature measurement and control system was developed based on Beijing HI-13 tandem accelerator SEE irradiation facility.The DUT temperature could be measured and controlled within the range of 90-450 K,and its control accuracy is better than ±1K.To verify the reliability of this system,the relationship between temperature and single event upset(SEU)cross-section was investigated in 150 nm thin film transistor(TFT)technology SRAM in the temperature range of 215-353 K.The results show that the SEU cross-section increases with temperature,and it is consistent with the theoretical expected result.
出处 《原子能科学技术》 EI CAS CSCD 北大核心 2015年第12期2261-2265,共5页 Atomic Energy Science and Technology
基金 国家自然科学基金资助项目(11405275)
关键词 低温 高温 重离子 单粒子效应 单粒子翻转 low temperature elevated-temperature heavy ion single event effect single event upset
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  • 1KOLASINSKI W A, KOGA R, SCHNAUSS E, et al. The effect of elevated temperature on latch- up and bit errors in CMOS devices[J]. IEEE Trans Nucl Sci, 1986, 33:1 605-1 609. 被引量:1
  • 2TRUYEN D, BOCH J, SAGNES B, et al. Tem- perature effect on heavy-ion induced parasitic current on SRAM by device simulation: Effect on SEU sensitivity[J]. IEEE Trans Nucl Sci, 2007, 54:1 025-1 029. 被引量:1
  • 3COOPER M S, RETZLER J P. High tempera- ture Schottky TTL latchup[J]. IEEE Trans Nucl Sci, 1978, 25:1 538-1 544. 被引量:1
  • 4STAPOR W J, JOHNSON R L, XAPSOS M A, et al. Single event upset dependence on temperature on an NMOS/resistive-load static RAM [J]. IEEE Trans Nucl Sci: 1986, 33:1 610-1 615. 被引量:1
  • 5MATTHEW J G, JONATHAN R A, BALAJI N, et al. Single-event transient measurements in nMOS and pMOS transistors in a 65 nm bulk CMOS technology at elevated temperatures[J]. IEEE Transactions on Device and Materials Reli- ability, 2011, 11: 179-186. 被引量:1
  • 6LARID J S, HIRAO T, ONODA S, et al. Tem- perature dependency of heavy ion induced current transients in Si epilayer devices[J]. IEEE Trans Nucl Sci, 2002, 49:1 389-1 395. 被引量:1
  • 7GUO G, HIRAO T, LARID J S, et al. Temper- ature dependency of single event transient current by heavy ion microbeam on pd-/n/nd- epilayer junctions[J]. IEEE Trans Nucl Sci, 2004, 51: 2 834-2 839. 被引量:1
  • 8TRUYEN D, BOCH J, SAGNESS B, et al. Temperature effect on heavy-ion-induced single- event transient propagation in CMOS bulk 0. 18μm inverter chain[J]. IEEE Trans Nucl Sci, 2008, 55: 2 001-2 006. 被引量:1
  • 9MATTHEW J G, JONATHAN R A, VISH- WANATH R, et al. Temperature dependence of digital single-event transients in bulk and fully- depleted SOI technologies[J]. IEEE Trans Nucl Sci, 2009, 56: 3 115-3 121. 被引量:1
  • 10MATTHEW J G, JONATHAN R A, BALAJI N, et al. Increased single-event transient pulse- widths in a 90 nm bulk CMOS technology operat- ing at elevated temperatures[J]. IEEE Transac- tions on Device and Materials Reliability, 2010, 10: 157-163. 被引量:1

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