摘要
倒装焊器件与常规的引线键合结构不同,现行的DPA标准不能完全适用于倒装焊结构。结合现有标准和倒装焊器件结构特点,以某塑封倒装焊集成电路器件为例,提出一套经过试验验证的、实用性强的倒装焊器件DPA试验流程。在原来标准的基础上提出了对BGA焊球材料成分分析、底充胶检查的超声扫描要求、芯片凸点结构检查等一些新的DPA要求。BGA焊球材料成分分析是使用能谱分析实现的,而芯片凸点结构检查则是通过对器件进行研磨开封实现的。经过试验验证,该流程方案可用于倒装焊集成电路器件的实际DPA工作。
Flip-chip structure is different from conventional wire-bonding structure,so current DPA standards are not suitable to flip-chip completely. Combining current standards and flip chip structure features,a series of verified and effective flip chip DPA procedure was proposed,which takes a kind of plastic flip chip as example. BGA solder balls material analysis, SAM requirement of underfill and bump structure examine were proposed on the base of original standards. BGA solder balls material analysis was realized by EDS and bump structure examine was realized by component grinding and unpackaging. Experiments prove that the procedure can be used in flip chip DPA task.
出处
《半导体技术》
CAS
CSCD
北大核心
2015年第12期950-953,共4页
Semiconductor Technology
关键词
倒装焊器件
破坏性物理分析
超声扫描
内部目检
能谱分析(EDS)
flip chip
destructive physical analysis
ultrasonic scanning
internal examination
energy dispersive spectroscopy（EDS）
