摘要
随着集成电路特征尺寸的不断减小,功率密度逐渐增加,电路的热分析和热管理越来越受到人们的重视。文章研究了一种基于延迟插入法的温度场仿真技术,首先通过电场和热场的等效原理建立热路网络,然后在热路的支路和节点上补充必要的辅助热感和热容项,从而构建迭代的求解格式,对温度场进行快速求解。与传统的仿真方法相比,延迟插入法不需要构造和求解大型稀疏矩阵,在内存消耗和计算效率上具有优势。数值算例验证了文章方法的有效性和准确性。
With the ever decreasing feature dimensions and increasing power density Or lntegratecl circuits, me thermal analysis and management become more and more important. In this paper, a new approach based on the latency insertion method （LIM） is introduced for the thermal simulation. Firstly, the equivalent thermal circuit is set up by means of the analogy between thermal and electrical phenomena. Then, small auxiliary thermal inductances and thermal capacitances are added in the necessary branches and nodes for the purpose of constructing updating schemes. The nodal temperatures can be calculated efficiently in this way. Comparing with the traditional methods, the proposed LIM does not need to build and solve big matrices. Therefore, it holds advantages in memory consumption and computational efficiency. The validity and efficiency of the proposed method is demonstrated by the numerical examples.
出处
《电子技术（上海）》
2015年第11期1-4,共4页
Electronic Technology
关键词
延迟插入法
热传导方程
热路模型.
Latency insertion method, heat conduction equation, thermal circuit model.
