摘要
为了研究SiCw/Cu复合材料的制备工艺、形成机理,进一步研究SiC含量对材料的组织结构、力学性能的影响.采用热压法和热等静压法制备了不同SiCw含量的SiCw/Cu复合材料,并对复合材料的致密度、显微组织和物相组成、维氏硬度、拉伸和压缩性能进行了研究,对拉伸断口进行分析.结果表明:SiCw有效阻碍Cu基体晶粒的长大,随着SiCw含量的增加,热压制备的SiCw/Cu复合材料的致密度、断后伸长率、拉伸屈服强度下降,而气孔率、维氏硬度与压缩屈服强度显著增加,抗拉强度先增加后降低.热压制备得到的1wt%SiCw/Cu复合材料,具有相对最优的综合力学性能:抗拉强度为156.9 MPa,拉伸屈服强度为112.5 MPa.采用热等静压法制备的3wt%SiCw/Cu复合材料,各方面性能都要优于相同组分的热压材料,抗拉强度达到175.6 Mpa,拉伸屈服强度达到123.2 MPa,维氏硬度达到101.8 HV.复合材料的强度是SiCw的增强作用与孔隙的弱化作用共同作用的结果,SiCw/Cu复合材料的断裂行为既表现出一定的韧性特征,又表现出一定的脆性特征.
In order to investigate the formation mechanism of SiCw/Cu composites, further study the influence of SiC content to the microstructure, mechanical properties of SiCw/Cu composites, SiCw/Cu composites were prepared by hot pressing sintering （HP） and hot isostatic pressing sintering （HIP）. Their densities, porosities, microstructures, Vickers hardness, tensile strengths （σts ） , tensile yield strengths （σtys ） and compression yield strengths（σcys ） were investigated. The micrograph of tensile fracture was analyzed by SEM （ Scanning Electron Microscope）. The results showed that Cu grains of composites remain original powder particle size order of magnitude after HP/HIP because the growth of Cu grain was hindered by SiCw. The densities of composites and its percentage elongation after fracture were decreased with increasing of SiCw. But their porosities, micro？hardness and compressive yield strengths were highly increased with increasing of SiCw. The 1wt%SiCw/Cu composite has the optimum mechanical property： σts was σtys was 112. 5 MPa. All aspects of performances of HIP composites were superior to HP composites：σts was 175.6 MPa,σtys was 123.2 MPa, and Vickers hardness was 101.8 in 3wt%SiCw/Cu composite. The curve of the tensile strengths vs. the content of SiCw for HP composite has a peak because the strength of the composite was affected by the SiCw reinforcing effect and the pore weakening effect. Fracture behavior of SiCw/Cu composites showed both toughness characteristic, and some brittle characteristics.
出处
《材料科学与工艺》
EI
CAS
CSCD
北大核心
2015年第5期115-122,共8页
Materials Science and Technology
关键词
SiCw/Cu复合材料
热压烧结
热等静压
微观组织
力学性能
断裂行为
SiCw/Cu composites
hot pressing sintering （ HP ）
hot isostatic pressing （ HIP ）
microstructure
mechanical properties
fracture behaviour
