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电流密度对Ni-SiC镀层组织结构及性能影响 被引量:3

Effect of current density on microstructure and property of Ni-SiC coatings
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摘要 在T8钢表面脉冲电沉积Ni-SiC镀层,用扫描电镜(SEM)、显微硬度计、X射线衍射仪(XRD)等研究电流密度对Ni-SiC镀层的表面粗糙度、内应力、显微硬度和组织结构的影响。结果表明:电流密度为6 A/dm^2时,Ni-SiC镀层表面粗糙度达到最小值(0.66μm),内应力达到最小值(120 MPa),显微硬度达到最大值(828HV);电流密度为6 A/dm^2时,Ni-SiC镀层表面颗粒尺寸较小,粗糙度较低,镀层致密性较好;Ni-SiC镀层为面心立方结构,且电流密度为6 A/dm^2时,镀层(111)晶面衍射强度较高。 The Ni-Si C coating was prepared on T8 steel by pulsed electrodeposition. The effects of current density on the surface roughness,innerstress,microhardness,and microstructure were studied by using scanning electron microscope(SEM),microhardness tester and X- ray diffraction(XRD). The results show that when the current density is 6 A/dm^2,the surface roughness of Ni- Si C coating reaches the minimum of 0.66 μm,the innerstress reaches the minimum of 120 MPa,and the microhardness reaches the maximum of 828 HV. The SEM analysis indicates that the Ni-Si C coating is fine and compact,and the roughness is lower when the current density is 6 A/dm^2. The XRD analysis shows that the Ni-Si C coating has a face centered cubic structure,and the diffraction intensity of the coating(111)is higher for the current density 6 A/dm^2.
出处 《兵器材料科学与工程》 CAS CSCD 北大核心 2016年第3期56-58,共3页 Ordnance Material Science and Engineering
基金 国家自然科学基金资助项目(51474072)
关键词 Ni-SiC镀层 表面粗糙度 内应力 显微硬度 Ni-SiC coatings surface roughness innerstress microhardness
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