摘要
在研究硅微角振动陀螺结构和温度特性的基础上,创建了二元高阶多项式补偿模型,并设计了基于STM32F405的硬件补偿电路,实现该陀螺仪实时温度补偿。实验结果表明:温度补偿后的标度因数温度系数和全温零偏稳定性分别由344×10-6/℃和441°/h减小为12.6×10-6/℃和40.6°/h,使得该陀螺仪的温度特性有明显改善,验证了该补偿方法的有效性和可行性。
A binary order polynomial compensation model is set up based on analyzing the structure and temperature characteristics of the silicon micro angular vibration gyroscope,and the hardware compensation circuit is designed based on the STM32F405,realize real-time temperature compensation of the gyroscope. Experimental result show that through compensation method proposed,the temperature coefficients of the scale factor and stability of full-temperature zero bias decrease from 344 × 10- 6/ ℃ and 441° / h to 12. 6 × 10- 6/ ℃ and 40. 6° / h,respectively,the temperature characteristics of the gyroscope is significantly improved and effectiveness and feasibility of the compensation method is verified.
出处
《传感器与微系统》
CSCD
2015年第11期26-29,共4页
Transducer and Microsystem Technologies
基金
国家自然基金重点资助项目(61434003)
关键词
硅微角振动陀螺仪
温度补偿
标度因数温度系数
全温零偏稳定性
silicon micro angular vibration gyroscope
temperature compensation
temperature coefficients of scale factor
stability of full-temperature zero bias
