摘要
以通信为主的PCB市场中，背板作为关键元件之一，向着高多层，大尺寸，高厚径比，多孔数、高可靠性方向发展，一方面推动及带动相关技术的发展，另一方面也带来许多工艺上的难点，对位精度要求就是第一个需要突破的关键技术工艺难点。本文就针对大尺寸1067mm、高多层（24层）重合度≤0．15mm对位要求进行工艺技术难点论述，简明陈述背板产品在对位关键技术上的系统管控。
With the development of Telecommunication industry, the backboard as a key component has high layer counts, huge panel size, high aspect ratio, high hole density and high reliability requirement. This paper traced out research profile of the backboard, which gave the statement of development and generalization of the backboard, but it brings many difficulties of technology, such as registration. The registration（≤6mil） of huge panel size（42inch）, high layer counts（24 layers） backboard was discussed in this paper, and declared the key technology of system control of registration backboard products.
出处
《印制电路信息》
2015年第A01期318-324,共7页
Printed Circuit Information
关键词
大尺寸
背板
对位精度
对位系统
Huge Panel Size
Backboard
Registration
Registration System
