摘要
文章采用特种环氧树脂及固化剂，研制开发了一种用于金属基板的无卤塞孔树脂。结果表明，制成的塞孔树脂具有可操作性高、热膨胀系数低、耐热性好、机械加工性能好等优异的综合性能，可满足金属基板塞孔的技术要求。
This paper adopts special epoxy resin and curing agent, developed a halogen-free hole plugging resin for MCPCB. The results showed that this resin has excellent properties with high maneuverability, low coefficient of thermal expansion, good heat resistance and good machinability, can meet the technical requirements of plugging hole for MCPCB.
出处
《印制电路信息》
2015年第A01期313-317,共5页
Printed Circuit Information
关键词
无卤
塞孔树脂
研制
金属基板
Halogen-Free
Hole Plugging Resin
Development
MCPCB
