摘要
随着背板厚度和尺寸的不断增加,钻孔的制作难度也随之增加。文章主要从钻头、铝片、垫板的选择、机台的调整、钻孔参数、钻孔方法等几个方面进行分析验证,通过优化相关资料和工艺方法,来解决钻孔过程中易出现的偏孔、孔粗、灯芯、钉头等一系列的品质问题。从而降低大背板钻孔工序的报废率,提高了大背板的制作能力。
With the increase of the backplane thickness and size, the difficulty of drilling also increases. This paper mainly from the aspects of drilling needle, aluminum sheet, plate selection, machine adjustment, drilling parameters and drilling method is analyzed and verified, through the optimization of data and process method, to solve the quality problems in the course of drilling, such as: partial hole, pore coarse, wick, nail head and so on. To reduce the scrap rate high back drilling process, improve the ability of making large backplane.
出处
《印制电路信息》
2015年第A01期58-67,共10页
Printed Circuit Information
关键词
背板
钻孔
灯芯效应
Back Panel
Drilling
Wick Effect