期刊文献+

硅基恒流二极管研究现状及展望 被引量:2

Research Status and Prospects of the Silicon-Based Current Regulative Diode
下载PDF
导出
摘要 主要综述了硅基恒流二极管(CRD)国内外的发展历史和研究现状,并以横向沟道CRD为例,详述了器件的工作原理和关键参数,并分析了影响器件性能的主要因素。同时重点研究了目前国内市场上CRD的主流制作方法,包括横向沟道结构和垂直沟道结构(注入形成p+区,沟槽填充多晶以及MOS结构等)。对不同器件结构的优缺点进行了比较分析,认为垂直沟道CRD在器件集成度和恒定电流调整等方面具有一定的优势。简要介绍了CRD在LED驱动中的应用。展望了CRD的未来发展前景。 The development history and research status of silicon-based current regulative diode( CRD) domestic and overseas are summarized. And take the lateral channel CRD for example,the working principle and key parameters of the device are described in detail,and the main factors which influence the device performance are analyzed. At the same time,the mainstream production methods of the CRD in the domestic market are mainly studied,including the lateral channel structure and vertical channel structure( p+formed by implantation,trench filled by poly-silicon and MOS structure). And the advantages and disadvantages of different device structures are compared and analyzed,considering that the vertical channel CRD has a considerable advantage in integration and current regulation. The application of the CRD in LED driver is brief introduced. Finally,the prospects on the future development of the CRD devices are given.
出处 《半导体技术》 CAS CSCD 北大核心 2015年第10期764-769,共6页 Semiconductor Technology
关键词 恒流二极管(CRD) 横向沟道 垂直沟道 沟槽结构 恒流源 current regulative diode(CRD) lateral channel vertical channel trench structure constant current source
  • 相关文献

参考文献35

  • 1Motorola Semiconductor Product Inc.The semiconductor data book[M].Arizona:Phoenix Press,1970:124-129. 被引量:1
  • 2Siliconix Inc.Small signal FET design catalog[M].Santa Clara:Siliconix Incorporated Press,2009:95-98. 被引量:1
  • 3方佩敏,王屹.S系列恒流二极管[J].电子世界,2011(1):12-14. 被引量:2
  • 4CODREANU C.Thermal stability of the current regulator diodes[C]∥Proceedings of the International Semiconductor Conference.Sinaia,Romania,1997:305-308. 被引量:1
  • 5TOURNIER D,PLANSON D,GODIGON P.et al.Simulation study of a novel current limiting device:a vertical 6H-Si C etched Accu JFET[C]∥Proceedings of International Semiconductor Conference.Sinaia,Romania,2000:201-204. 被引量:1
  • 6冯晓敏.硅基CRD的设计[D].山东:大连理工大学,2012:2-4. 被引量:1
  • 7唐娟.中国半导体分立器件产业的发展[J].科技传播,2010,2(11):42-42. 被引量:2
  • 8林言方,孙衍人,高志坚,徐时进,张民,陈冠军.串级JFET恒流器件特性分析[J].杭州大学学报(自然科学版),1992,19(3):285-291. 被引量:1
  • 9ZHU L,CHOW T P.Analytical modeling of high-voltage 4H-Si C junction barrier Schottky(JBS)rectifiers[J].IEEE Transactions on Electron Devices,2008,55(8):1857-1863. 被引量:1
  • 10刘树林,张华曹,柴常春编著..半导体器件物理[M].北京:电子工业出版社,2005:336.

二级参考文献39

  • 1宋南辛 徐义刚.晶体管原理[M].国防工业出版社,1992,9.331-337. 被引量:1
  • 2宋南辛 徐义刚.单极型晶体管[M].山东工业大学,1993,6.224-331. 被引量:1
  • 3张新.半导体器件工艺原理[M].山东工业大学,1992,1.12-23,91-139. 被引量:1
  • 4Lorenz L, Deboy G, Knapp A, et al.COOLMOS-a New Milestone in High Voltage Power MOS[A].Proceedings of llth ISPSD[C].1999:3-10. 被引量:1
  • 5Leo Lorenz.CoolMOS-A New Approach Toward and Idealized Power Switch[C].Proc. EPE '99 Conf., 1999. 被引量:1
  • 6CHEN Xingbi.Theory of the Switching Response of CB MOST[J].Chinese Journal of Electronics,Jan. 2001,10( 1 ) : 1-6. 被引量:1
  • 7陈星弼.ZL01141993.一种制造含有复合缓冲层半导体器件的方法[P].2004. 被引量:1
  • 8Xingbi Chen.Method of Manufacturing Semiconductor Device having Composite Buffer Layer. US 7192872 B2,2007. 被引量:1
  • 9陈星弼.ZL93115356,具有异型掺杂岛的半导体耐压层[P],1997. 被引量:1
  • 10Xingbi Chen.Voltage Sustaining Layer with Opposite-Doped Islands for semiconductor Power Devices,US 6635906 B1,2003. 被引量:1

共引文献44

同被引文献9

引证文献2

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部