摘要
在850℃、10 MPa压力下对纯钛和纯铜进行了扩散连接。采用扫描电镜对不同连接时间下接头界面微观组织进行了表征,以研究连接时间对连接界面组织的影响。实验结果表明,当连接时间为30 s时,在钛/铜界面上存在没有完全闭合的微观孔洞,无扩散反应层生成。当连接时间增加到60 s,在接头界面生成了βTi,Ti2Cu,Ti Cu和Ti3Cu4等金属间化合物相,反应层总厚度约2μm。当连接时间增加到90 s,在接头界面产生了βTi,Ti2Cu,Ti Cu,Ti3Cu4,Ti2Cu3和Cu4Ti等金属间化合物,反应层厚度增加约5μm。这说明随着连接时间的增加,由于钛/铜之间互扩散的加剧,反应层不断变厚。
Titanium and copper was conducted at 850 ℃ under 10 MPa pressure with diffusion bonding. Microstructure characterization of the resultant joints was performed in SEM to investigate the effect of holding time on the interfacial microstructure. It was found that micro-voids presented at the joint interface when the bonding time was 30 s and the joint was free of any reaction products. With an increased bonding time of 60 s,a range of intermetallic compounds including Ti2 Cu,Ti Cu and Ti3Cu4 with a total thickness of 2 μm were observed at the joint. Further increasing the bonding time to 90 s resulted in the formation of a joint composed of β-Ti,Ti2 Cu,Ti Cu,Ti3Cu4,Ti2Cu3 and Cu4Ti,reaction layer thickness increase was about 5 μm. It can be thus concluded that increasing bonding time would facilitate the Ti-Cu inter-diffusion,thereby leading to the increase in the total thickness of the reaction layers.
出处
《电焊机》
2015年第8期154-156,共3页
Electric Welding Machine
关键词
钛
铜
扩散连接
微观组织
titanium
copper
diffusion bonding
microstructure
